PRODUCTION | SINGLE-SIDED, DOUBLE-SIDED, MULTI-LAYERS, SILVER AND CARBON THRU-HOLE, RIGID-FLEX PCB. |
MATERIAL | FR-4BT, POLYIMIDE, TEFLON, 4=8 LAYERS, MULTI-LAYERS. |
CIRCUIT WIDTH & SPACE | 4 milj (0.1mm) Mimimum |
SMT PADS DISTANCE | 16 milj (0.4mm) Central Minimum |
HOLE SIZE | 8 milj (0.2mm) Minimum |
PRECISION HOLE | +/- 2 milj (0.05mm) Ture position and location |
BLIND/BURIED HOLE | 6 milj (0.15mm) Laser Drilling (Special requirement can be request). |
BOARD THICKNESS | DOUBLE-SIDED UP TO 0.1mm, 4 LAYERS UP TO 0.3mm, 6 LAYERS UP TO 0.5 TO 0.6mm. |
PLATING THICKNESS | COPPER UP TO 25 MICRON, HOT AIR SOLDER LEVELLING UP TO 4 MICRON, NICKEL UP TO 7 MICRON. |
REMARK | We provide Gold Plating or Electroless Gold for board surface treatment up to over 0.2milj. |
CAD SYSTEMS | INFRA-RED CONVEYEROVEN SYSTEMS |
ART-WORKS AND FILM SYSTEMS | UV CONVEYER OVEN SYSEMS |
CNC DRILLING SYSTEMS | BAKING OVEN SYSTEMS |
PUNCH PRESS SYSTEMS | ELECTRIC HEAT LAMINATOR |
ELECTROLESS COPPER PLATING LINE | SURFACE CLEAN TREATMENT SYSTEMS |
COPPER AND SOLDER PLATING LINE | PEEL STRENGTH TESTING SYSTEMS |
NICKEL AND GOLD PLATING LINE | MICROSCOPE SYSTEMS |
SURFACE CLEANING BRUSH MACHINE | VOLTAGE, INSULATION, RESISTANCE TESTING SYSTEMS. |
ETCHING AND STRIPPING MACHINE | HIGH TEMPERATURE HUMIDITY SYSTEMS |
DRY FILM LAMINATOR | EXPOSURE MACHINE |
SILK SCREEN PRINTING MACHINE | HIGH-TENSION TESTING SYSTEMS |
AUTO SCRUBBING LINE | CARBON IPQC SYSTEMS |
DRY & WET FILMS PRINTING SYSTEMS | VISUAL INSPECTION SYSTEMS |
CIRCUIT IPQC SYSTEMS |